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Digital Forensics

Mobile Forensics-iPhone 15 Pro Max Teardown

By April 8, 2024No Comments

Mobile Forensics-iPhone 15 Pro Max Teardown

Mobile Forensics

iPhone 15 Pro Max Teardown

Introduction

iPhone 15 Max pro Teardown

This teardown of the iPhone 15 Pro Max is designed to provide a comprehensive overview of its internal components, architecture, and security mechanisms. It aims to equip forensic analysts with the necessary knowledge to navigate the complexities of the device, ensuring they can efficiently and effectively extract and analyze data without compromising its integrity.

Objective

iPhone 15 Max pro Teardown

The primary objectives of this teardown

Identification and Analysis of Hardware Components, Security Mechanisms Overview, Data Storage and Management, Connectivity and Network Interfaces, Power Management

Identification and Analysis of Hardware Components

Detailed examination of the processor, memory modules, storage, and other critical components. Understanding these components is crucial for bypassing security measures and accessing encrypted data.

Security Mechanisms Overview

Insight into the iPhone 15 Pro Max’s security features, including the latest encryption protocols, biometric safeguards, and hardware-based security elements. This knowledge is vital for developing strategies to access protected data.

Data Storage and Management

Exploration of the device’s storage architecture, including the file system and data partitioning. This information is key to locating, extracting, and interpreting data.

Connectivity and Network Interfaces

Examination of the device’s communication modules—Wi-Fi, Bluetooth, NFC, and cellular connections. This analysis aids in understanding potential data transmission points and intercepting data in transit.

Power Management

Study of the battery and power management system to ensure that the device can be kept operational throughout the forensic examination process.

Hardware Modules

Main PCB Side 1

iPhone 15 Max pro Teardown

1
Likely Kioxia K5A4RB6302CA12304 256 GB NAND flash
2
Possibly Apple 338S00843 audio DSP
3
Texas Instruments TPS65657B0 display power supply
4
Texas Instruments LM3567A1 flash controller
5
Apple 338S00537 audio amplifier
6
Apple 338S01026-B1 power management

Hardware Components-Main PCB

  1. Likely Kioxia K5A4RB6302CA12304 256 GB NAND flash
  2. Possibly Apple 338S00843 audio DSP
  3. Texas Instruments TPS65657B0 display power supply
  4. Texas Instruments LM3567A1 flash controller
  5. Apple 338S00537 audio amplifier
  6. Apple 338S01026-B1 power management

Main PCB Side 1 – Connectivity

iPhone 15 Max pro Teardown

Main PCB Side 1_2
1
Likely NXP Semiconductor NFC controller

Hardware Components-Main PCB Connectivity

  1. Likely NXP Semiconductor NFC controller

Main PCB Side 2

iPhone 15 Max pro Teardown

Main PCB Side 2_1
1
Apple 338S00616 power management
2
STMicroelectronics STCPM1A3 power management
3
STMicroelectronics STB605A11 power management
4
STMicroelectronics STCPM1A3 power management
5
STMicroelectronics STCPM1A3 power management
6
Apple APL109A/338S01022 power management
7
Likely Texas Instruments SN2012017 battery charger
8
Apple 338S00946-B0 power management

Hardware Components-Main PCB 2

  1. Apple 338S00616 power management
  2. STMicroelectronics STCPM1A3 power management
  3. STMicroelectronics STB605A11 power management
  4. STMicroelectronics STCPM1A3 power management
  5. Apple APL1V02/339S01257 A17 Pro hexa-core applications processor w/ hexa-core GPU layered under likely a SK hynix H58G66AK6HX132 8 GB LPDDR5 SDRAM memory
  6. Apple APL109A/338S01022 power management
  7. Likely Texas Instruments SN2012017 battery charger
  8. Apple 338S00946-B0 power management

Main PCB Side 2 (cont.)

iPhone 15 Max pro Teardown

Main PCB Side 2_2
1
Apple 338S00739 audio CODEC
2
Likely Texas Instruments TPS61280H battery front-end DC-DC converter
3
Apple 338S00537 audio amplifier
4
Apple 338S00537 audio amplifier
5
Winbond W25Q80DVUXIE 1 MB serial NOR flash memory
6
Broadcom BCM59365EA1IUBG wireless power receiver

Hardware Components-Main PCB 2

  1. Apple 338S00739 audio CODEC
  2. Likely Texas Instruments TPS61280H battery front-end DC-DC converter
  3. Apple 338S00537 audio amplifier
  4. Apple 338S00537 audio amplifier
  5. Winbond W25Q80DVUXIE 1 MB serial NOR flash memory
  6. Broadcom BCM59365EA1IUBG wireless power receiver

Main PCB Side 2 – Connectivity

iPhone 15 Max pro Teardown

Main PCB Side 2_2_Connectivity
1
Likely Apple 339M00298 UWB Module

Hardware Components-Main PCB 2 Connectivity

  1. Likely Apple 339M00298 UWB Module

Main PCB Side 2 – Sensors

iPhone 15 Max pro Teardown

Main PCB Side 2_2_Connectivity
1
Bosch Sensortec 6-axis MEMS accelerometer & gyroscope

Hardware Components-Main PCB 2 Sensors

  1. Bosch Sensortec 6-axis MEMS accelerometer & gyroscope

Radio Board Side 1

iPhone 15 Max pro Teardown

Radio Board Side 1
1
Qualcomm QET7100 wideband envelope tracker
2
Qualcomm QET7100 wideband envelope tracker
3
Likely Qualcomm clock generator
4
STMicroelectronics ST33J secure microcontroller
5
Qualcomm PMX65 power management

Hardware Components-Radio Board Side

  1. Qualcomm QET7100 wideband envelope tracker
  2. Qualcomm QET7100 wideband envelope tracker
  3. Likely Qualcomm clock generator
  4. STMicroelectronics ST33J secure microcontroller
  5. Qualcomm PMX65 power management

Radio Board Side 1 – Connectivity

iPhone 15 Max pro Teardown

Radio Board Side 1_Connectivity
1
Possibly Apple 339S01232 WiFi & Bluetooth module
2
Qorvo QM76305 front-end module
3
Broadcom AFEM-8234 front-end module
4
Skyworks SKY58440-11 front-end module
5
Qualcomm SDR735 RF transceiver
6
Qualcomm SDR735 RF transceiver
7
Qualcomm SDX70M Snapdragon X70 modem
8
Qualcomm SMR546 RF transceiver

Hardware Components- Radio Board Side 1 – Connectivity

  1. Possibly Apple 339S01232 WiFi & Bluetooth module
  2. Qorvo QM76305 front-end module
  3. Broadcom AFEM-8234 front-end module
  4. Skyworks SKY58440-11 front-end module
  5. Qualcomm SDR735 RF transceiver
  6. Qualcomm SDR735 RF transceiver
  7. Qualcomm SDX70M Snapdragon X70 modem
  8. Qualcomm SMR546 RF transceiver

Radio Board Side 1 – Connectivity (cont.)

iPhone 15 Max pro Teardown

Radio Board Side 1_Connectivity_1
1
Likely Skyworks SKY50313 front-end module
2
Possibly Apple 339M00287 front-end module
3
Broadcom AFEM-8245 front-end module

Hardware Components- Radio Board Side 1 – Connectivity

  1. Likely Skyworks SKY50313 front-end module
  2. Possibly Apple 339M00287 front-end module
  3. Broadcom AFEM-8245 front-end module

Credits & Disclaimer

Teardown Image credits: https://www.ifixit.com/ 

Disclaimer: This article is shared for educational and knowledge sharing purpose for aspiring digital forensics students or Digital Forensics professionals

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